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Technology Roadmap ¼¼Êõ·Ïß | |||||
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inch [mm] | ±ê×¼ | ÅúÁ¿ | ÑùÆ· | Ñз¢ | |
¹Ø¼üÊôÐÔ | ²ãÊý | Up to 32L | Up to 40L | 40L µ½ 48L | >50+L |
×îС/×î´óºñ¶È | 012¡± [.30]/.200" [5.0] | .008" [.20]/.256" [6.5] | .006¡± [.15]/.315" [8.0] | TBD/¡Ý.394" [10.0] | |
×î´ó pnl ³ß´ç | 24x28[610x712] | 24x30 [610 x 760] | 24x32 [610 x 812] | ´ý¶¨ | |
×îСÏß¿íÏ߾ࣨͺñ£© | ÄÚ²ã | .003" [.076] H | .0025" [.064] H | <.002" [.05] H | <.002" [.05] H |
Íâ²ã | .004" [.10] 1 | .003" [.076] 1 | <.0025" [.064] 1 | <.0025" [.064] 1 | |
¹«²î | ¡À.0005" [.013] | ¡À.0003" [.008] | ¡À.00025" [.005] | ¡À.0002" [.005] | |
»úе¿×´óС | ×îС×ê¾× | .008" [.20] | .006" [.15] | .005" [.13] | .004" [.10] |
¿×padÖ±¾¶ | +.008" [.20] | +.008" [.20] | +.006" [.15] | .004" [.10] | |
ºñ¾¶±È | 25:1 | 30:1 | 40:1 | £¾40:1 | |
Base copper weights: 1=1oz H=1/2 oz, T=3/8 oz, Q=1/4 oz | |||||
¿×½á¹¹ | ÀØÉä¿×²ã | 2+N+2 | 3+N+3 | 4+N+4,ELIC | UNiFYi MVs |
Âñ¿× | Yes | Yes | Yes | Yes | |
µþ¿× | Stacked/Staggered | Offset/Staggered | Offset/Staggered | Offset/Staggered | |
ÀØÉä¿× | ×îС¿× | .004" [.10] | .003" [.076] | .002" [.05] | .002" [.05] |
¿×padÖ±¾¶ | +.006" [.15] | +.004" [.10] | +.003" [.76] | +.003" [.076] | |
ºñ¾¶±È | 0.8:1 | 0.8:1 | 1:1 | 1.2:1 | |
µ¼Í¨&·Çµ¼Í¨Ìî¿× | ×îС¿×¾¶ | .008" [.20] | .006" [.15] | .005" [.13] | <.005" [.13] |
ºñ¾¶±È | 25:1 | 30:1 | 40:1 | £¾40:1 | |
×躸 | ¶Ôλ¾«¶È | ¡À.002" [.05] | ¡À.0015" [.038] | ¡À.001" [.025] | Tangency |
×îС¿ª´° | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
×îСÂÌÓÍÇÅ | .003" [.08] | .002" [.05] | .0015" [.038] | Eng Eval | |
±íÃæ´¦Àí | ENIG, OSP | ENEPIG | Thick Gold Multiple Finishes | ´ý¶¨ | |
Im Sn, Im Ag | Wire Bondable Gold | ||||
LF HASL | Multiple Finishes | ||||
Hard Gold Body | |||||
ÎïÁÏÑ¡Ôñ | Rogers 3000/4000 | Ultra Low Loss Dk/Df | ÂñÏß ÂñÔª¼þ | ||
Halogen Free FR4 EMC 828, EMC 888K | I-Tera? I-Speed? EMC 891K | Tachyon 100G? MetroWave | |||
Buried Capacitance | Polyimid, Megtron 6N | Megtron 7N, EMC 890K | |||
408 HR Nelco-13s | Hybrid PCBs | Thermal Management PCBs |